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Extreme Temperature Electronics Using a Reconfigurable Analog Array

机译:使用可重新配置的模拟阵列极端温度电子器件

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Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.
机译:温度和辐射耐受电子,以及长寿命的耐受性是未来美国航空航天队任务所需的关键能力。极端环境的电流电子设备侧重于组件级鲁棒性和硬化。还采用了补偿技术,例如偏置消除电路。但是,目前的技术只能在极端环境中确保非常有限的寿命。以前的工作基于可不断变化的硬件技术提出了一种新颖的方法,这允许在极端环境中操作期间自适应原位电路重新设计/重新配置。该技术将补充材料/设备进步,并增加使命能力来生存恶劣环境。这项工作描述了由JPL和Spawar开发的新的可重构模拟芯片,该芯片是针对极端温度和进化硬件实验的目标。基于GM-C技术,该芯片可以通过电压偏压调节调整其功能,并适应极端温度。该调谐过程将由进化算法控制。本文介绍了可重新配置模拟芯片的详细信息以及系统级概述。还描述了一些早期的实验。

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