TRANSIENT THERMAL AND HYDRODYNAMIC PERFORMANCES OF FLAT HEAT PIPE SUBJECTED TO HEATING WITH MULTIPLE ELECTRONIC COMPONENTS

摘要

This work is aimed to simulate the transient performances of a flat heat pipe (FHP) used to cool electronics components in automotive applications. A transient 3D thermal model (T3DTM) of the FHP wall is performed to calculate the heat transfer through the wall of the FHP. This model is coupled with a transient 2D hydrodynamic model (T2DHM) which determines the flows both in wick and vapour core. An energy balance and Clausius-Clapeyron law permit to represent the phase change mechanisms at the liquid-vapour interface. The performed T2DHM model includes the solution of the complete governing equations in both wick and vapor core. The T2DHM is able to predict the velocity and pressure distributions of the FHP working fluid and then the FHP transient response. That analysis helps determine the maximum pore radius of the wick necessary to support the total pressure drop in the FHP. The heat removal capability of the FHP is highlighted through a comparison with a solid copper plate of the overall dimensions as the FHP.