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OPTIMIZATION OF THERMOELECTRIC MODULES FOR COMPUTER SYSTEM THERMAL MANAGEMENT AND INFRASTRUCTURE ENERGY EFFICIENCY

机译:优化计算机系统热管理和基础设施能效的热电模块

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With the proliferation of multiple cores on a single processor and the integration of numerous stacked die in chip packages, the resulting non-uniformity in power dissipation necessitates spatially and temporally localized control of temperature in the package. Thermoelectric (TE) devices can potentially provide one mechanism to achieve such control. Unfortunately, at typical junction-to-ambient temperatures, the coefficient-of-performance (COP) of existing bulk TE devices tends to be quite low. As a result, for many high-power systems, the additional power input required to operate a TE cooling module can lead to an increase in the overall system cost-of-ownership, causing TE cooling solutions to be excluded from cost-sensitive thermal management solutions in high-volume computer systems. However, recent trends of compaction and consolidation of computer servers in high-density data centers have resulted in a dramatic increase in the burdened cost-of-ownership of mission-critical IT facilities. For example, the energy consumption of the cooling infrastructure for many high-density data centers can equal or exceed the power consumption of the compute equipment. Thus, for the growing enterprise thermal management segment, the appropriate metric is no longer the COP of the thermal solution but rather the COP of the cooling ensemble, which takes into account the energy efficiency of cooling solutions in the chip, system, rack, data center and facility. To examine the effects of chip-level COP on the ensemble-level COP, this paper explores a case study comparing two ensemble solutions. In one case, local hotspots on a chip in a three-dimensional package are mitigated by increasing fan power at the system level (and subsequently, in the computer room and the rest of the ensemble). In another case, local hotspots at the chip are mitigated through spot-cooling via TE cooling modules. For each of these cases, the COP of the ensemble is evaluated. The model suggests that while feasible, the benefit of using TEs at current performance levels is limited. However, ongoing research that may improve TE performance in the future has the potential to enhance infrastructure energy efficiency.
机译:随着单个处理器的多个芯的增殖以及芯片封装中的许多堆叠管芯的集成,所产生的功率不均匀性需要在包装中的空间和时间局部地控制温度。热电(TE)器件可能提供一种实现这种控制的一种机制。遗憾的是,在典型的交叉点到环境温度下,现有散装设备的系数(COP)趋于相当低。结果,对于许多大功率系统,操作TE冷却模块所需的额外电源输入可能导致整体系统所有权的增加,导致TE冷却解决方案被排除在成本敏感的热管理之外大容量计算机系统中的解决方案。然而,最近在高密度数据中心中的计算机服务器的压实和整合的趋势导致了对关键任务IT设施的负担的负担急剧增加。例如,许多高密度数据中心的冷却基础设施的能量消耗可以等于或超过计算设备的功耗。因此,对于越来越多的企业热管理段,适当的公制不再是热解的COP,而是冷却合奏的COP,这考虑了芯片,系统,机架,数据中的冷却解决方案的能效中心和设施。本文探讨了两种合奏解决方案的芯片级警察对合奏级别缔约方缔约方缔约方缔约方缔约方缔约方议团的影响。在一种情况下,通过在系统级别(以及随后,在计算机室和整体的其余部分中,通过增加风扇功率来减轻三维封装中的芯片上的局部热点。在另一个情况下,通过TE冷却模块通过点冷却来减轻芯片的局部热点。对于这些情况中的每一个,评估集合的COP。该模型表明,虽然可行,但在当前性能水平下使用TES的益处是有限的。然而,在未来可能提高TE性能的持续研究有可能提高基础设施能源效率。

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