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Analysis on the Error Caused by Working Frequency Drift for the Silicon Micromechanical Gyroscope

机译:硅微机械陀螺仪工作频率漂移引起的误差分析

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The Silicon Micromechanical Gyroscope (SMG) has broad application in various fields, but its development is badly restricted by the error caused by temperature drift. The temperature drift will lead to the change of working frequency, and it is one of the main factors which caused the drift error. Presently, fewer researchers focus on how the working frequency affects the scale factor and bias of the gyroscope. In this paper, the effects of the working frequency drift on the scale factor and bias of the gyroscope will be analyzed in theory and simulation, in terms of the dynamics equations and the process of signal detection of SMG. The results show that, the working frequency drift has a significant impact on the performance of the gyroscope, and typically, considering 1 Hz working frequency drift, the relative variation of scale factor is up to the order of 10,000 ppm, and the variation of bias is up to the order of 10~2(°/h). The conclusions of this paper provide a basis for the further research on the temperature error models and compensations for SMG.
机译:硅微机械陀螺仪(SMG)在各个领域都有广泛的应用,但其发展受到温度漂移引起的误差的严重限制。温度漂移会导致工作频率的变化,这是引起漂移误差的主要因素之一。目前,很少有研究者关注工作频率如何影响陀螺仪的比例因子和偏置。本文将从动力学方程和SMG信号检测过程两方面对工作频率漂移对陀螺仪比例因子和偏置的影响进行了理论和仿真分析。结果表明,工作频率漂移对陀螺仪的性能有显着影响,通常,考虑到1 Hz工作频率漂移,比例因子的相对变化可达10,000 ppm量级,并且偏置的变化也很大。最高可达10〜2(°/ h)。本文的结论为进一步研究SMG的温度误差模型和补偿方法提供了依据。

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