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Final characterization of the ATLAS IBL detector 241 modules with ~(241)Am during the construction phase

机译:在施工阶段期间,具有〜(241)AM的ATLAS IBL检测器241模块的最终表征

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During the first LHC long shutdown (2013/14) a new innermost pixel layer will be added to the present ATLAS Pixel Detector. The Insertable B-Layer (IBL) is a high-reliability, ultra light and radiation hard Pixel Detector assembled with 3D n-in-p and planar n-in-n pixel sensors. Facing the effects of increased luminosity and radiation damage, IBL is expected to improve the b-tagging efficiency, help with pattern recognition performance and add tracking precision with respect to the current detector. Single and double chip modules are loaded on local mechanical support, in the form of 14 staves arranged in cylindrical barrel around the beam pipe. The production of the modules has already started, aiming for a total production of 24 staves including spares. Systematic Quality Assurance (QA) and Quality Control (QC) plans concerning modules, staves and flex from production to final assembly have been put in place. QA is performed in several collaborating institutes and final validation before installation in the ATLAS experiment will be carried out at CERN. Dedicated set-ups have been constructed in order to perform the full chain of QA/QC tests on the production staves. A CO_2 cooling system is used to cool the pixel modules down to -35 °C and an electronic chain similar to the final one has been developed. Furthermore a linear motion system carrying two 241Am sources with an activity of 41 MBq each is mounted over the stave in order to perform a final characterization of the sensor's performance. The realization of source scans on the 24 production staves permits to analyze the response of sensors to radiation, to easily identify dead pixels, and to provide data for an eventual re-calibration of the charge calibration. The setup and first results obtained on prototype staves are described in detail.
机译:在第一个LHC Long Shutdown(2013/14)期间,将添加新的最内部像素层到当前的Atlas像素检测器。可插入的B层(IBL)是用3D N-IN-P和平面N-N个像素传感器组装的高可靠性,超光和辐射硬像素检测器。面对亮度和辐射损伤增加的影响,预计IBL将提高B标签效率,帮助模式识别性能并相对于电流检测器添加跟踪精度。单个和双芯片模块装载在局部机械支撑上,以围绕梁管围绕圆柱形筒布置的14个柱子的形式。该模块的生产已经开始,旨在总共生产24个螺纹术,包括备件。系统的质量保证(QA)和质量控制(QC)有关模块,螺汽机和弯曲从生产到最终组装的计划。在安装在地图集实验中的安装之前,在若干合作机构和最终验证中进行了QA将在CERN中进行。已经建立了专用设置,以便在生产汽机上执行全链QA / QC测试。 CO_2冷却系统用于将像素模块冷却至-35°C,并且已经开发了类似于最终的电子链。此外,携带两个241AM源的线性运动系统,每个源具有41 MBQ的活动,以便在铲架上安装,以便执行传感器性能的最终表征。在24个生产桩上实现源扫描允许分析传感器对辐射的响应,以容易地识别死像素,并提供用于最终重新校准的充电校准的数据。详细描述了在原型Staves上获得的设置和第一结果。

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