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New Observation of an Abnormal Leakage Current in Advanced CMOS Devices with Short Channel Lengths Down to 50nm and Beyond

机译:新的CMOS器件中的异常泄漏电流的新观察,短通道长度低至50nm及更远

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In this work, for the first time, an abnormal leakage current has been observed in MOSFET with 50nm channel length and beyond. This effect shows that, in an ultra-short channel MOSFET, sub-threshold swing (SS) and I_(off) are decreased for back-biased nMOSFET and pMOSFET. This effect is attributed to the BJT-induced current from the source to the drain. An experimental approach has been used to verify the existence of this BJT current component. As a consequence, this BJT current can be reduced with appropriate control of the S/D-to-substrate junction. As an application of the approach to advanced embedded-SiC MOSFET with various splits, it was found that a higher band-offset of S/D-to-substrate junction will give rise to a larger the BJT ballistic transport current. This provides us important information on reducing the leakage current for advanced CMOS with 50nm and beyond.
机译:在这项工作中,首次在MOSFET中观察到异常漏电流,其中50nm通道长度及更远。该效果表明,在超短通道MOSFET中,对后偏置的NMOSFET和PMOSFET减小了子阈值摆动(SS)和I_(OFF)。这种效果归因于从源到漏极的BJT感应电流。已经使用实验方法来验证该BJT电流组件的存在。结果,可以通过适当的控制S / D谱图结合来减少该BJT电流。作为具有各种分裂的先进嵌入式SiC MOSFET的方法,发现S / D-基板结的更高带偏移将产生较大的BJT弹道传输电流。这为我们提供了有关减少50nm及以后的高级CMOS漏电流的重要信息。

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