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A 0.4 V 75 kbit SRAM macro in 28 nm CMOS featuring a 3-adjacent MBU correcting ECC

机译:在28 nm CMOS中的0.4 V 75 kbit SRAM宏,具有3相邻的MBU校正ECC

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A 0.4 V single cycle 75 kbit SRAM macro protected with a multi-bit upset (MBU) correcting circuit is fabricated in a 28 nm LP-CMOS process. The novel error correcting circuit (ECC) is capable of 3-bit adjacent error correction and 8bit adjacent error detection. Simulation results show that the code provides a 2.35x improvement in corrected soft error rate (SER) over a Bose-Chaudhuri-Hocquenghem (BCH) double error correcting (DEC) code at a raw-SER of 1300 FIT/Mb while requiring 3 fewer check-bits. Further an alternative 2-bit adjacent error correcting implementation provides an corrected-SER approximately equal to the BCH DEC code for the same checkbit overhead as a single error correcting double error detecting (SEC-DED) code in the same error channel. Measurement results confirm an average active energy of 0.015 fJ/bit and leakage current of 10.1 pA/bit.
机译:采用28 nm LP-CMOS工艺制造了具有多位翻转(MBU)校正电路保护的0.4 V单周期75 kbit SRAM宏。新型纠错电路(ECC)能够进行3位相邻纠错和8位相邻纠错检测。仿真结果表明,与原始Bose-Chaudhuri-Hocquenghem(BCH)双重错误校正(DEC)代码相比,该代码在原始SER为1300 FIT / Mb的情况下,校正后的软错误率(SER)提高了2.35倍,而减少了3个校验位。另外,替代的2位相邻纠错实现方式为相同的校验位开销提供与在相同错误信道中的单个纠错双纠错检测(SEC-DED)码近似等于BCH DEC码的校正SER。测量结果证实平均有功电能为0.015 fJ / bit,泄漏电流为10.1 pA / bit。

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