Collaborative approach for practical modeling of microcircuit failures in high-reliability applications

摘要

A new research project sponsored by the Aerospace Vehicle Systems Institute (AVSI) is developing a simple reliability estimation methodology for both random failure rate and the time to intrinsic wearout of integrated circuits. Using similar physics of failure (PoF) and statistical models for both types of failures, the project seeks data and analysis from semiconductor manufacturers, leaving most of the proprietary details to them, and only uses the models to scale results between use conditions. Although the project is focused by aerospace requirements, the driving concerns are common among all high-reliability industries, and both the methodology and the semiconductor industry engagement we seek should have broad applicability. Interaction with the part suppliers and foundries, assisted by the Reliability Simulation Council (RSC), is a key part of this strategy. In this paper, we will review the motivation, conceptual methodology and status of the prototype spreadsheet-based tool.