Low-resistance contact layers on the basis of polymer composites containing silver nanoparticles dedicated to semiconductor devices

摘要

Manufacturing of semiconductor devices consists of many equally significant stages. Every improperly-performed detail may cause abnormal functioning of the device which is very undesirable. Electrical contact manufacturing guarantees the connection between the "inner world" containing phenomena on the molecular level of the device and the "outer world" including connections to other objects and enabling consumer usability. In the following thesis two kinds of pastes containing silver nanoparticles in polymer matrix have been used to make electrical contacts. Performed layers have been compared with sputtering-method made contacts.