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High-resolution X-ray diffraction and electron microscopy study of porous GaAs substrates

机译:多孔GaAs衬底的高分辨率X射线衍射和电子显微镜研究

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We investigated structural perfection of porous gallium arsenide layers formed in GaAs (001). Different modes of electrochemical etching of n-type GaAs(001) substrates in fluoride-iodide aqueous electrolytes were used to form porous layers. Their structural properties were investigated by high resolution X-ray and synchrotron radiation diffraction and electron microscopy (SEM, TEM) techniques. It was shown that a single current pulse with a high magnitude forms a discontinuous porous layer with a smooth surface. Subsequent etching with a relatively low current density forms a homogeneous porous structure in the depth with approximately 30% porosity. The porous layer thickness can be varied from a few microns to several tens of microns depending on the etching time. The lattice parameter of porous GaAs layers along the surface normal is decreased by a factor of 1.5×10~(-4) compared to the GaAs substrate. This contraction is related to the formation of vacancy type structural defects as revealed by the measurement of x-ray diffuse scattering.
机译:我们研究了在GaAs(001)中形成的多孔砷化镓层的结构完善性。使用碘化氟电解质水溶液中n型GaAs(001)衬底的不同模式的电化学刻蚀来形成多孔层。通过高分辨率X射线和同步加速器辐射衍射以及电子显微镜(SEM,TEM)技术研究了它们的结构特性。结果表明,高强度的单个电流脉冲形成具有光滑表面的不连续多孔层。随后以较低电流密度进行的蚀刻在深度处形成具有大约30%孔隙率的均匀多孔结构。取决于蚀刻时间,多孔层的厚度可以在几微米到几十微米之间变化。与GaAs衬底相比,多孔GaAs层沿表面法线的晶格参数降低了1.5×10〜(-4)倍。如通过X射线扩散散射的测量所揭示的,该收缩与空位型结构缺陷的形成有关。

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