首页> 外文会议>ASME conference on smart materials, adaptive structures and intelligent systems >THERMOMECHANICAL BEHAVIOR OF LOW CTE METAL-MATRIX COMPOSITES FABRICATED THROUGH ULTRASONIC ADDITIVE MANUFACTURING
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THERMOMECHANICAL BEHAVIOR OF LOW CTE METAL-MATRIX COMPOSITES FABRICATED THROUGH ULTRASONIC ADDITIVE MANUFACTURING

机译:通过超声增材制造法制备的低CTE金属基复合材料的热力学行为

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Shape memory and superelastic NiTi are often utilized for their large strain recovery and actuation properties. The objective of this research is to utilize the stresses generated by pre-strained NiTi as it is heated in order to tailor the CTE of metal-matrix composites. The composites studied consist of an Al 3003-H18 matrix with embedded NiTi ribbons fabricated through an emerging rapid prototyping process called Ultrasonic Additive Manufacturing (UAM). The thermally-induced strain of the composites is characterized and results show that the two key parameters in adjusting the effective CTE are the NiTi volume fraction and prestrain of the embedded NiTi. From the observed behavior, a constitutive composite model is developed based constitutive SMA models and strain matching composite models. Additional composites were fabricated to characterize the NiTi-Al interface through EDS and DSC. These methods were used to investigate the possibility of metallurgical bonding between the ribbon and matrix and determine interface shear strength. Interface investigation indicates that mechanical coupling is accomplished primarily through friction and the shear strength of the interface is 7.28 MPa. Finally, using the developed model, a composite was designed and fabricated to achieve a near zero CTE. The model suggests that the finished composite will have a zero CTE at a temperature of!35°C.
机译:形状记忆和超弹性NiTi通常用于其大的应变恢复和驱动特性。这项研究的目的是利用预应变的NiTi在加热时产生的应力,以调整金属基复合材料的CTE。研究的复合材料由Al 3003-H18基体和嵌入的NiTi带组成,这些带是通过一种新兴的快速成型工艺(称为超声波增材制造(UAM))制成的。对复合材料的热诱导应变进行了表征,结果表明,调节有效CTE的两个关键参数是NiTi体积分数和嵌入NiTi的预应变。根据观察到的行为,基于本构SMA模型和应变匹配复合模型,开发了本构复合模型。制造了其他复合材料,以通过EDS和DSC表征NiTi-Al界面。这些方法用于研究带材与基体之间进行冶金结合的可能性,并确定界面剪切强度。界面研究表明,机械耦合主要通过摩擦来实现,界面的剪切强度为7.28 MPa。最后,使用开发的模型,设计并制造出复合材料,以实现接近零的CTE。该模型表明,完成的复合材料在35°C的温度下CTE为零。

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