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Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing

机译:超声波增材制造的多功能金属基复合材料及其嵌入的印刷电子材料

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摘要

This work proposes a new method for the fabrication of multifunctional Metal Matrix Composite (MMC) structures featuring embedded printed electrical materials through Ultrasonic Additive Manufacturing (UAM). Printed electrical circuitries combining conductive and insulating materials were directly embedded within the interlaminar region of UAM aluminium matrices to realise previously unachievable multifunctional composites. A specific surface flattening process was developed to eliminate the risk of short circuiting between the metal matrices and printed conductors, and simultaneously reduce the total thickness of the printed circuitry. This acted to improve the integrity of the UAM MMC's and their resultant mechanical strength. The functionality of embedded printed circuitries was examined via four point probe measurement. DualBeam Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) milling were used to investigate the microstructures of conductive materials to characterize the effect of UAM embedding energy whilst peel testing was used to quantify mechanical strength of MMC structures in combination with optical microscopy. Through this process, fully functioning MMC structures featuring embedded insulating and conductive materials were realised whilst still maintaining high peel resistances of ca. 70 N and linear weld densities of ca. 90%. (C) 2017 Elsevier Ltd. All rights reserved.
机译:这项工作提出了一种新的方法,用于通过超声波增材制造(UAM)制造具有嵌入式印刷电子材料的多功能金属基复合材料(MMC)结构。结合了导电和绝缘材料的印刷电路直接嵌入UAM铝基体的层间区域中,以实现以前无法实现的多功能复合材料。开发了一种特定的表面平坦化工艺,以消除金属基体与印刷导体之间发生短路的风险,并同时减少印刷电路的总厚度。这起到了改善UAM MMC的完整性以及由此产生的机械强度的作用。嵌入式印刷电路的功能通过四点探针测量进行了检查。使用双束扫描电子显微镜(SEM)和聚焦离子束(FIB)铣削来研究导电材料的微观结构,以表征UAM嵌入能量的影响,同时使用剥离测试结合光学显微镜来量化MMC结构的机械强度。通过这一过程,实现了功能完备的MMC结构,其特征是嵌入了绝缘和导电材料,同时仍保持了约200的高耐剥离性。 70 N,线性焊缝密度约为90%。 (C)2017 Elsevier Ltd.保留所有权利。

著录项

  • 来源
    《Composites》 |2017年第3期|342-354|共13页
  • 作者单位

    Southeast Univ, Minist Educ, Key Lab MEMS, Nanjing 210096, Jiangsu, Peoples R China|Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England;

    Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England;

    Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England;

    Univ Leeds, Mech Engn, Leeds LS2 9JT, W Yorkshire, England;

    Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England;

    Univ Leeds, Mech Engn, Leeds LS2 9JT, W Yorkshire, England;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Ultrasonic additive manufacturing; Metal matrix composites; 3D printing; Embedded electrical circuitry; Mechanical testing; Electron microscopy;

    机译:超声波增材制造;金属基复合材料;3D打印;嵌入式电路;机械测试;电子显微镜;
  • 入库时间 2022-08-18 01:17:29

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