Study on the touch risk of high density packaging bonding wire under mechanical shock condition

摘要

With the development of high-density integrated circuits, ultra-fine pitch wire bonding process gradually becomes a hot spot. At present, most of the reliability research on the bonding wire concentrates on the solder joint, but the bonding wire receives little attention. Actually, bonding wires may vibrate and touch to each other due to the mechanical shock. This paper tried to study the reliability of the bonding wire under mechanical shock, a finite element simulation method for the deflection displacement prediction of high-density package bonding wires under mechanical shock was proposed. The factors affecting the lateral deflection displacement of the bonding wire were studied, which include bond span, bond height, wire diameter and shock acceleration. The transverse deflection displacement model of the bonding wire was established to determine whether there is a risk of touch when subjected to mechanical shock. The results showed that the bond span was the most significant factor on the deflection displacement. The recommendations for improving the design were also proposed.