As FPGA strengthening its role from high performance computing, wireline/wireless to accelerator in data center, the needs for high frequency and logic element drives up current and powers consumption rapidly. A few years back, sub-100W would represent most top line applications. Today, FPGA devices of hundreds of amperes and watts are at high demand, especially the stacked silicon line product. Package engineers encounter new challenges to meet electro-migration requirement for specified life time at high junction temperature. This presentation will share how Xilinx develops high power FPGA package to maximize current-carrying capability. The in-depth review includes various design factors and its trade-off between current distribution, temperatures, EM, life time, power integrity, as well as methodology to predict performances.
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