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Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

机译：使用涂有刮刀涂层的柔性Ag纳米颗粒层涂覆Cu凸块的新型键合方法

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A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

机译：通过使用刮板涂层在铜凸块上涂覆的柔性不完全烧结的银纳米颗粒，开发了一种新型的凸块结构。拟议的结构成功地结合到铜基板上。剪切强度达到118MPa。

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《IEEE CPMT Symposium Japan》|2013年|1-4|共4页
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作者
Fu Weixin; Mizuno Jun; Shoji Shuichi; Kasahara Takashi;
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Ag nanoparticle bump; low temperature bonding; squeegee-coating method;

机译：银纳米粒子凸点低温粘接刮涂法;

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1. A Metal Bump Bonding Method Using Ag Nanoparticles as Intermediate Layer [J] . Fu Weixin, Nimura Masatsugu, Kasahara Takashi, Journal of Electronic Materials . 2015,第11期

机译：以Ag纳米粒子为中间层的金属凸点结合方法
2. Hierarchical nanothorns MnCo_2O_4 grown on porous/dense Ni bi-layers coated Cu wire current collectors for high performance flexible solid-state fiber supercapacitors [J] . Ji Yaqiang, Xie Jinqi, Wu Jian, Journal of power sources . 2018,第JULa31期

机译：多层纳米刺MnCo_2O_4生长在多孔/致密Ni双层涂覆的铜线集电器上，用于高性能柔性固态光纤超级电容器
3. Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging [J] . Wu Jie, Xue Songbai, Wang Jingwen, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2019,第期

机译：原位形成的PR-涂覆的Al2O3纳米颗粒对等温老化期间Sn-0.3Ag-0.7Cu-0.06pr / Cu焊接接头的界面微观结构和剪切行为
4. Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating [C] . Fu Weixin, Mizuno Jun, Shoji Shuichi, IEEE CPMT Symposium Japan . 2013

机译：用Cu型涂层涂覆含有柔性Ag纳米粒子层的Cu凸块的新型粘接方法
5. Tack Coat Bond Strength Evaluation Methods and Mechanistic Design of the Interface for Multilayer Asphalt Pavement. [D] . Karshenas, Afshin. 2015

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6. Improved Chloride Ion Sensing Performance of Flexible Ag-NPs/AgCl Electrode Sensor Using Cu-BTC as an Effective Adsorption Layer [O] . Byungkwan Kwak, Soobin Park, Han-Seung Lee, 1970

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7. Development of a Method for Synthesizing Ag/Cu Composite Nanoparticles and Their Bonding Property [O] . Takafumi Maeda, Norihisa Matsubara, Yoshio Kobayashi, 2017

机译：一种合成Ag / Cu复合纳米粒子及其粘合性的方法的研制
8. Flux Pinning of Y-Ba-Cu-O Films Doped With BaZrO3 Nanoparticles by Multilayer and Single Target Methods (Postprint). [R] . F. J. Baca N. A. Pierce P. N. Barnes T. A. Campbell T. J. Haugan 2007

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Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

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