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IR-drop and Signal-integrity Measurement of BGA by A Broadband push-push VCO

机译:BGA通过宽带推送VCO的IR-DROP和信号完整性测量

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The working voltage of the electronic products becomes lower, so the small variable of voltage is serious for the electronic products. The effects which are classified as power integrity (PI) and signal integrity (SI) become increasingly obvious in the package when the circuits work in the environments of high speed and high frequency. In this paper, the push-push voltage controlled oscillator (VCO) has broadband and sensitivity which is proposed and used to analysis IR-drop and signal integrity. The package's structure is Ball Grid Array (BGA). The way of testing IR-drop and signal integrity by VCO's wide tuning range and high tuning sensitivity in this research. Consequently, these effects can be analyzed by observing the relationship between the voltages, frequencies and output signal.
机译:电子产品的工作电压变低,因此对电子产品的电压的小变量是严重的。当电路在高速和高频环境中工作时,归类为电源完整性(PI)和信号完整性(SI)的效果变得越来越明显。本文采用推挽式电压控制振荡器(VCO)具有宽带和灵敏度,提出并用于分析IR下降和信号完整性。包装的结构是球网格阵列(BGA)。通过VCO的广泛调谐范围和高调灵敏度测试IR-DAP和信号完整性的方式。因此,可以通过观察电压,频率和输出信号之间的关系来分析这些效果。

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