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Design of Patch Antenna in Embedded Glass Fan Out Package for 77-GHz Automotive Radar

机译:嵌入式玻璃垃圾箱的设计为77GHz汽车雷达的包装包装

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A 77-GHz patch antenna in embedded glass fan out (eGFO) package is presented in this paper. Compared with the classic embedded wafer level ball grid array (eWLB) package, the eGFO package features the advantages of high gain and low fabrication cost. A method of optimizing the thickness of glass is proposed to design antenna in eGFO package, which is not conducive for antenna design due to its large dielectric constant. For convenience of measurement, probe feeding is used in this work. Subsequently, transition from silicon chip to grounded coplanar waveguide (GCPW) line on PCB is presented. The measured results show that the maximum gain of proposed antenna in eGFO package reaches 10.0 dBi. The proposed antenna-in-package has great potential application for modern automotive radar system.
机译:本文提出了嵌入式玻璃风扇的77GHz贴片天线(EGFO)包装。与经典嵌入式晶圆级球栅阵列(EWLB)封装相比,EGFO包装具有高增益和低制造成本的优点。提出了一种优化玻璃厚度的方法,以设计EGFO封装中的天线,这对于由于其大的介电常数而不利用天线设计。为方便测量,在这项工作中使用探针进料。随后,提出了从硅芯片转变为PCB上的硅芯片到接地的Coplanar波导(GCPW)线。测量结果表明,EGFO包装中提出的天线的最大增益达到10.0 dBi。该拟议的天线包装具有巨大的现代汽车雷达系统潜在应用。

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