Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS

摘要

CAD sybsystem for logi-thermal analysis of the digital circuits is presented. Logical circuits are described by VHDL language. Thermal regimes are calculated by electro-thermal analogy method. For the calculation of the thermal resistances and capacitances the thermal 3D simulator Overheat-IC based on semi-analytical solution of three-dimensional heat conduction equation is used. For simultaneous calculation of logical and thermal characteristics of IC analog and mixed-signal simulator Questa ADMS is used.