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Pattern Pruner: Automatic Pattern Size Reduction Method that Uses Computational Intelligence-Based Testing

机译:模式修剪:使用基于计算智能的测试的自动图案尺寸减少方法

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This paper describes a novel computational intelligence test method with automatic pattern size reduction algorithm -Pattern Pruner for improving the efficiency of localization for the design weaknesses and/or faults using state-of-art automatic test equipment (ATE). Computational intelligence and Pattern Pruner software implemented on semiconductor automatic test equipment allows finding worst case test pattern and identifying design weaknesses. This is demonstrated by detection of a hang-up in a pseudo-SRAM test chip with asynchronous operation and hidden refresh, Package parasitics are found to be the cause of the failure, and debugging is performed by modification of the power network.
机译:本文介绍了一种新颖的计算智能测试方法,具有自动图案尺寸减少算法-Pattern修剪器,用于提高使用最先进的自动测试设备(ATE)设计弱点和/或故障的定位效率。在半导体自动测试设备上实现的计算智能和模式PRUNER软件允许找到最坏情况测试模式并识别设计弱点。这通过检测在具有异步操作和隐藏刷新中的伪SRAM测试芯片中的挂起来证明,发现封装寄生件是故障的原因,并且通过修改电网来执行调试。

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