Aluminum Ingot Clamping Process Dynamics Modeling and Analysis Based on The Aluminum Ingot Flip Device

摘要

The problems of dropping ingot and locking ingot that there are when the aluminum ingot flip Device is working were analyzed. The kinematical analysis and dynamic analysis on aluminum ingot clamping process were carried out. The relationship between the working reliability of flip device and the aluminum ingot pose before the aluminum ingot accessing flip device was obtained. The constraint conditions of aluminum ingot accessing flip device were given. This paper provided key technical parameters to the research and development of aluminum ingot pose self-tuning device.