Modified Assembly Systems and Processes for the Mounting of Electro-Optical Components

摘要

Optical interconnections have been used for years in long distance networks and gain more and more importance for optical applications on system and board level. With the integration of optical layers into printed circuit boards the functionality can be increased while the board size remains the same. The success of this technology depends in particular on the availability of efficient production solutions. Photonic packaging implicates basically three challenges for the placement of electro optical components. With a modified process sequence and optimized processes low cost mass production is possible. This article describes the conceptual design and the implementation of a continuous process chain into a modified standard assembly system.