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Effect of mold on corrosion behavior of printed circuit board with different surface finish materials

机译：模具对不同表面处理材料印刷电路板腐蚀行为的影响

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《European corrosion congress》|2013年|1|共1页
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S. W. Zou; X.G. Li; C.F.Dong; H.Y. Li; K. Xiao;
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1. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability [J] . Conseil-Gudla Helene, Jellesen Morten S., Ambat Rajan Journal of Electronic Materials . 2017,第2期

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2. Effect of surface finish material on printed circuit board for electrochemical migration [J] . Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung Microelectronics reliability . 2008,第4期

机译：表面处理材料对印刷电路板上电化学迁移的影响
3. Effect of static magnetic field on mold corrosion of printed circuit boards [J] . Bioelectrochemistry . 2020,第期

机译：静磁场对印刷电路板模具腐蚀的影响
4. Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability [C] . Morten S. Jellesen, Bjørn Duus Mikkelsen, Rajan Ambat European corrosion congress . 2013

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5. A systematic approach for selection of best lead-free printed circuit board (PCB) surface finish [D] . Subbarayan, Guhan 2007

机译：选择最佳无铅印刷电路板（PCB）表面光洁度的系统方法
6. Corrosion Acceleration of Printed Circuit Boards With an Immersion Silver Layer Exposed to Bacillus cereus in an Aerobic Medium [O] . Yuting Hu, Kui Xiao, Dawei Zhang, -1

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7. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Surface Finishing of Printed Wiring Boards. Mainly on Electroless Plating. [O] . Kazuyoshi OKUNO 1993

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8. Guidelines for Waste Reduction and Recycling: Metal Finishing, Electroplating, Printed Circuit Board Manufacturing [R] . 1989

机译：减少废物和回收利用指南：金属表面处理，电镀，印刷电路板制造

Effect of mold on corrosion behavior of printed circuit board with different surface finish materials

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