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Thermal Degradation Behavior of Polyaniline in Polyaniline/Tunsten Carbide Composite

机译:聚苯胺/碳化钨复合材料中聚苯胺的热降解行为

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Polyaniline/tungsten carbide (PANI/WC) composite was synthesized by chemical oxidative polymerization of aniline using ammonium persulfate as the oxidant and thermal treated in air at 150°C,250°C,350°C and 450°C to 2 hours.The changes of structure,crystalline and conductivity were investigated by Fourier Transformed Infrared (FT-IR),Fourier Transformed Raman (FT-Raman),X-Ray Diffraction (XRD) and four-probe technique.The results showed that PANI/WC composite showed much-improved thermal stability compared to pure PANI.But the conductivity of PANI/WC is reduced to some extent (1.73 S/cm,the conductivity is reduced by about 82%) after thermal treated at 250°C,and dropped by 6 orders of magnitude (3.25× 10-6S/cm) at 350°C.This may be explained by that only a fraction of dopant losses during thermal treatment at 250°C,but after thermal treatment at 350°C,along with cross-linking,chain scission and oxygen,resulting in destruction of crystal structure,decrease of the emeraldine sequence.
机译:以过硫酸铵为氧化剂,通过苯胺的化学氧化聚合反应,在空气中分别于150°C,250°C,350°C和450°C热处理2小时,合成了聚苯胺/碳化钨(PANI / WC)复合材料。通过傅里叶变换红外光谱,傅里叶变换拉曼光谱,X射线衍射和四探针技术研究了结构,晶体和电导率的变化。与纯PANI相比,热稳定性大大提高。但是,在250°C热处理后,PANI / WC的电导率在一定程度上降低了(1.73 S / cm,电导率降低了约82%),并下降了6个数量级可以在350°C时达到(3.25×10-6S / cm)的量级。这可以解释为,在250°C的热处理过程中,但在350°C的热处理之后,只有少量的掺杂剂损失以及交联,断链和氧,导致晶体结构破坏,翡翠序列减少。

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