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Evaluation of Piezoelectric Ta_2O_5 Thin Films Deposited on Sapphire Substrates

机译:沉积在蓝宝石基材上的压电Ta_2O_5薄膜的评价

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X-axis-oriented tantalum pentoxide (Ta_2O_5) piezoelectric thin films were deposited on sapphire (Al_2O_3) substrates using an RF magnetron sputtering system. The crystallinity and Rayleigh-type surface acoustic wave (R-SAW) propagation properties of the thin films were evaluated. For a Ta_2O_5 thin film deposited on the R-Al_2O_3 substrate plane, a similar preferential (200) orientation to that for a Ta_2O_5 thin film deposited on a SiO_2 glass substrate was obtained. For the first mode of the R-SAW on the R-plane Al_2O_3 sample, a coupling factor of 1.78% and a phase velocity of 4,895 m/s were obtained for a normalized film thickness of 0.225. For the c-Al_2O_3 substrate plane, the possibility of the epitaxial growth of a hexagonal Ta_2O_5 thin film with (203) orientation was shown. Furthermore, for the R-Al_2O_3 substrate plane, the possibility of the homoepitaxial growth of an orthorhombic Ta_2O_5 thin film with (201) orientation by using an oxide Ta thin film (TaO_x) as a buffer layer was also shown. However, no increase in coupling factor and no major improvement in propagation loss were observed upon these crystallizations because the hexagonal Ta_2O_5 has no piezoelectricity and the Ta_2O_5 thin film deposited on the TaO_x buffer layer had polycrystalline structure.
机译:使用RF磁控溅射系统沉积在蓝宝石(AL_2O_3)基板上沉积X轴取向的钽五氧化钽(TA_2O_5)压电薄膜。评价薄膜的结晶度和瑞利型表面声波(R-锯)传播性质。对于沉积在R-AL_2O_3衬底平面上的TA_2O_5薄膜,获得了与沉积在SiO_2玻璃基板上的Ta_2O_5薄膜的相似的优先权(200)取向。对于R平面Al_2O_3样品的R型锯的第一模式,获得1.78%的耦合因子和4,895m / s的相速度,归一化膜厚度为0.225。对于C-AL_2O_3衬底平面,示出了具有(203)取向的六边形TA_2O_5薄膜外延生长的可能性。此外,对于R-Al_2O_3衬底平面,还示出了通过使用氧化物Ta薄膜(Tao_x)作为缓冲层的氧化物Ta_2O_5薄膜与(201)取向的同性端遗传生长的可能性。然而,由于六边形Ta_2O_5没有压电,并且在Tao_x缓冲层上沉积在Tao_x缓冲层上的压电性并且沉积在Tao_x缓冲层上的Ta_2O_5薄膜的情况下没有增加耦合因子并且在这些结晶中没有增加。

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