Effective EMI shielding for semiconductor packages through novel conformal coating

摘要

Enhanced wireless, memory, and data processing components enable innovative and optimal user experiences largely influenced by the growth of Internet of Things (IoT) applications. However, these radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. Consequently, advancement in electromagnetic interference (EMI) shielding technology is a critical factor as end products and components move toward miniaturization with higher density designs and increased function at higher speeds. So far, the industry norm for EMI shielding has been to use custom-designed metallic cans. However, since cans consume large, valuable space and require complex and inflexible board layouts, alternative solutions, including physical vapor deposition (PVD) and spraying, are gaining interest. To address these challenges, a unique material with rheological properties that provides reliable performance in stressful electronic conditions has been developed. The material can be applied at room temperature in a coating as thin as 3-5μm and provides high shielding effectiveness, uniform conformal coating coverage, and excellent adhesion to untreated organic surfaces. Furthermore, this EMI coating material technology allows easy production scalability and design flexibility with minimal cost of ownership.