The comprehensive solution of Ultra Top Metal stress impact on Seal Ring

摘要

In recent years, the development of integrated circuit technology has been changed with each passing day. With the continuous reduction of devices feature size, the integration and performance of circuits have been continuously improved, and the serious challenges in reliability have also been increasing. In this paper, the influence of ultra top metal(UTM) layer stress on different searing ring structures was systematically studied based on the failure of terminal chip. The results showed that the stress of the ultra top metal layer was greater than that of the thin top metal layer. The serious stress from top metal had great influence on single slot searing ring structure. In this paper, the crack defect fail was solved completely through the increasing via dot density in searing ring structure