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An Economic Layout Solution with 20 UM Scribe Line and Integrated Test PAD Based on 55 NM Platform

机译:基于55 NM平台的经济布局解决方案及其基于55纳米平台的集成测试垫

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摘要

In this work, an economic layout is designed for production of small sized chip with 20 um scribe line and integrated chip yield test pad. Three different kinds of layout are presented and thoroughly analyzed. Compared-with conventional 60 um scribe line layout, there is about 1 7% increase of chip quantity for a 20 um scribe line-layout with concentrated stacking mode of test key (TK) and marks. Such a novel layout maybe can be further expanded to different technology nodes and wafer size.
机译:在这项工作中,经济布局设计用于生产小型芯片,具有20微米划线和集成芯片产量测试垫。 提出并彻底分析了三种不同的布局。 与传统的60MY划线布局进行比较,芯片数量增加约为20微米划线 - 布局的芯片量,具有测试键(TK)和标记的集中堆叠模式。 这种新布局可以进一步扩展到不同的技术节点和晶片尺寸。

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