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From Microns to Nanometers: The IRDS and AMC Control

机译:从微米到纳米:IRD和AMC控制

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The Yield Enhancement Chapter of the International Roadmap for Devices and Systems (IRDS), and more specifically, the focus topics of Wafer Environment Contaminant Control and Surface Environment Contaminant Control, are responsible for identifying airborne molecular contamination (AMC) and setting guideline limits in all areas of semiconductor processing. Today AMC control is required in FEOL and BEOL operations and this control may be achieved fab-wide or at certain critical processes, potentially also at different levels for different processes.
机译:设备和系统(IRDS)国际路线图的产量增强章节,更具体地说,是晶圆环境污染物控制和表面环境污染物控制的重点主题,负责识别空中分子污染(AMC)并确定指南限制半导体加工领域。今天,FEOL和BEOL操作需要AMC控制,并且该控制可以在不同的过程中实现Fab宽或某些关键过程,也可能在不同的过程中进行不同的水平。

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