Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit

摘要

As a process node is getting smaller, the types of failure mechanisms are increasing. New EFA technologies and methods are constantly development. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Picosecond Imaging Circuit Analysis (PICA) detector with enhanced sensitivity for discussing Time Resolved Emission (TRE). The key applications where the time-resolved imaging capability is very effective in reducing the debug time and improving the understanding the failure behaviors of VLSI chip for fault characteristics