Improvement of Heat Dissipation in IPM Packaging Structure

摘要

In recent years, with the development of electronic integration technology, high-speed railway transportation, new energy development, smart grid, smart furniture and other emerging industries, higher requirements have been put forward for intelligent power modules, and improvement measures have been proposed. This article will delve into the thermal management optimization of a small out-line package (SOP) typed integrated power module (IPM) packaging structure through simulation. Four optimization schemes are used to analyze the feasible conditions for improving the heat dissipation of the IPM packaging structure. They are separately from the point of view as the peripheral packaging structure, the internal layout, the internal three-dimensional stack structure and double copper substrates. It can be found that in the last scheme, the maximum temperature of the IPM packaging structure can be effectively reduced.