Identifying Faulty TSVs in 3D Stacked IC during Pre-bond Testing

摘要

Design of through-Silicon-Via (TSV) based 3D IC is became feasible recently. Testing of TSVs is an important issue in this respect. It is a challenge to test the TSVs before the bonding of different layers so that the manufacturing defects of TSV can be identified properly. In this paper, we are trying to test the TSVs before bonding. Here we have proposed a heuristic algorithm to locate the faulty TSVs uniquely and at the same time it reduces the test time significantly for locating those faulty TSVs. Simulation results how that our algorithm achieved up to on an average 33% reduction in test time for a 20 TSV network than serial testing approach. Our algorithm also performs better in terms of est time reduction than the previous work present in the literature.