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CSP-Filling: A New X-Filling Technique to Reduce Capture and Shift Power in Test Applications

机译:CSP填充:一种新的X填充技术,可减少测试应用中的捕获和移位功率

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In this paper, we present a new X-filling technique to reduce the shift and capture transitions occurred during scan based test application. The unspecified bits in the test cubes are filled with the logic value of 1's or 0's using the proposed don't care filling technique, namely CSP ¡ filling in such a way that the both average power and peak power in test applications are reduced. In our approach, the capture transition is made to be within the peak-power limit of the circuit under test while reducing the average power in shift-in phase of test applications. The experimental results obtained from ISCAS'89 benchmark circuits show that, the CSP ¡ filling technique provides a significant reduction in both shift and capture transitions in test mode.
机译:在本文中,我们提出了一种新的X填充技术,以减少在基于扫描的测试应用程序期间发生的移位和捕获过渡。使用提议的无关位填充技术(即CSP¡填充),以降低测试应用程序中的平均功率和峰值功率的方式,将逻辑块中未指定的位填充为1或0的逻辑值。在我们的方法中,捕获转换要在被测电路的峰值功率极限之内,同时降低测试应用移入阶段的平均功率。从ISCAS'89基准电路获得的实验结果表明,CSP填充技术显着降低了测试模式下的移位和捕获跃迁。

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