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The understanding of multi-level RTN in trigate MOSFETs through the 2D profiling of traps and its impact on SRAM performance: A new failure mechanism found

机译:通过陷阱的二维剖析来了解三栅MOSFET中的多级RTN及其对SRAM性能的影响:发现了一种新的故障机制

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The impact of multi-level RTN on SRAM cells bas been experimentally demonstrated on both planar and trigate CMOS devices. First, to study multi-level RTN, a simple experimental method has been developed to take the 2D profiling of multi-traps in both oxide depth (vertical) and channel(lateral) directions in the gate oxide. Then, the role of traps in the switching mechanisms of SRAM cells has also been examined. Results show that the multi-traps will degrade RSNM (read static noise margin), as well as cause transition failure in SRAM operations. This is the first being observed and reported that will be considered as a major criterion in the future low voltage design of SRAM cells.
机译:在平面和三栅极CMOS器件上均已通过实验证明了多级RTN对SRAM单元的影响。首先,为了研究多级RTN,已开发出一种简单的实验方法来对栅氧化层中的氧化层深度(垂直)和沟道(横向)方向的多阱进行二维剖析。然后,还研究了陷阱在SRAM单元开关机制中的作用。结果表明,多陷阱会降低RSNM(读取静态噪声容限),并导致SRAM操作中的转换失败。这是首次被观察到并被报道,将被认为是未来SRAM单元低压设计的主要标准。

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