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AN INVESTIGATION OF TREATING ADIABATIC WALL TEMPERATURE AS THE DRIVING TEMPERATURE IN FILM COOLING STUDIES

机译:在膜冷却研究中将绝热壁温作为驱动温度的研究

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In film cooling heat transfer analysis, one of the core concepts is to deem film cooled adiabatic wall temperature (T_(aw)) as the driving potential for the actual heat flux over the film-cooled surface. Theoretically, the concept of treating T_(aw) as the driving temperature potential is drawn from compressible flow theory when viscous dissipation becomes the heat source near the wall and creates higher wall temperature than in the flowing gas. But in conditions where viscous dissipation is negligible, which is common in experiments under laboratory conditions, the heat source is not from near the wall but from the main hot gas stream; therefore, the concept of treating the adiabatic wall temperature as the driving potential is subjected to examination. To help investigate the role that T_(aw) plays, a series of computational simulations are conducted under typical film cooling conditions over a conjugate wall with internal flow cooling. The result and analysis support the validity of this concept to be used in the film cooling by showing that T_(aw) is indeed the driving temperature potential on the hypothetical zero wall thickness condition, ie. T_(aw) is always higher than T_w with underneath (or internal) cooling and the adiabatic film heat transfer coefficient (h_(af)) is always positive. However, in the conjugate wall cases, T_(aw)is not always higher than wall temperature (T_w), and therefore, T_(aw) does not always play the role as the driving potential. Reversed heat transfer through the airfoil wall from downstream to upstream is possible, and this reversed heat flow will make T_w > T_(aw) in the near injection hole region. Yet evidence supports that T_(aw) can be used to correctly predict the heat flux direction and always result in a positive adiabatic heat transfer coefficient (h_(af)). The results further suggest that two different test walls are recommended for conducting film cooling experiments: a low thermal conductivity material should be used for obtaining accurate T_(aw) and a relative high thermal conductivity material be used for conjugate cooling experiment. Insulating a high- conductivity wall will result in T_(aw) distribution that will not provide correct heat flux or h_(af) values near the injection hole.
机译:在薄膜冷却传热分析中,核心概念之一是将薄膜冷却的绝热壁温(T_(aw))视为薄膜冷却表面上实际热通量的驱动电位。从理论上讲,当粘性耗散成为壁附近的热源并产生比流动气体中更高的壁温时,将T_(aw)作为驱动温度势的概念是根据可压缩流动理论得出的。但是在粘性耗散可以忽略不计的情况下(在实验室条件下的实验中很常见),热源不是来自壁附近,而是来自主要的热气流。因此,对将绝热壁温作为驱动电位的概念进行了研究。为了帮助研究T_(aw)的作用,在具有内部流动冷却的共轭壁上典型的膜冷却条件下进行了一系列计算模拟。结果和分析表明,在假设的零壁厚条件下,T_(aw)确实是驱动温度电势,从而支持该概念在薄膜冷却中的有效性。在(或内部)冷却下,T_(aw)始终高于T_w,并且绝热膜的传热系数(h_(af))始终为正。但是,在共轭壁情况下,T_(aw)并不总是高于壁温(T_w),因此,T_(aw)并不总是起到驱动电位的作用。通过翼型壁从下游到上游的反向传热是可能的,并且这种反向的热流将使近注入孔区域中的T_w> T_(aw)。然而,证据支持T_(aw)可用于正确预测热通量方向,并始终导致绝热传热系数(h_(af))为正。结果进一步表明,建议使用两个不同的测试壁进行薄膜冷却实验:应使用低导热率的材料来获得准确的T_(aw),而使用相对较高导热率的材料来进行共轭冷却实验。隔离高电导率壁将导致T_(aw)分布,该分布将无法在注入孔附近提供正确的热通量或h_(af)值。

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