Enabling large focal plane arrays through mosaic hybridization

摘要

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors.Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit pathsby hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mmdiameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individuallyfabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of thehybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached withpermanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon componentsunderneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validatethe successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration isdirectly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.