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Reducing shot count through Optimization based fracture

机译:通过基于优化的裂缝减少射弹数量

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The increasing complexity of RET solutions with each new process node has increased the shot count of advanced photomasks. In particular, the introduction of inverse lithography masks represents a significant increase in mask complexity. Although shot count reduction can be achieved through careful management of the upstream OPC strategy and improvement of fracture algorithms, it is also important to consider more dramatic departures from traditional fracture techniques. Optimization based fracture allows for overlapping shots to be placed in a manner that allows the mask intent to be realized while achieving significant savings in shot count relative to traditional fracture based methods. We investigate the application of Optimization based fracture to reduce the shot count of inverse lithography masks, provide an assessment of the potential shot count savings, and assess its impact on lithography process window performance.
机译:每个新工艺节点的RET解决方案的复杂性不断增加,从而增加了高级光掩模的拍摄数量。特别地,反光刻掩模的引入代表掩模复杂性的显着增加。尽管可以通过谨慎地管理上游OPC策略和改进压裂算法来实现减少射弹计数,但考虑与传统压裂技术的更大差异也很重要。与传统的基于裂缝的方法相比,基于优化的裂缝允许以允许实现掩膜意图的方式放置重叠的镜头,同时大大节省了镜头数量。我们研究基于优化的裂缝的应用,以减少反光刻掩模的镜头数量,评估潜在的镜头数量节省,并评估其对光刻工艺窗口性能的影响。

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