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The trouble starts with using electrons - Putting charging effect correction models to the test

机译:麻烦始于使用电子-将充电效应校正模型进行测试

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Improvement of pattern placement accuracy is essential to solve upcoming challenges in mask making. Placement errors are driven by multiple effects with electron mediated resist surface charging being a major error source. Modeling this systematic effect thus allows the determination of the placement errors before plate processing. This opens the door to an effective charging compensation. In this paper we study the simulated benefit of two distinct charging compensation models in the context of full-scale mask production layouts. The potential pattern placement improvements are evaluated using actual placement results obtained without charging effect corrections. An in depth comparison of the two models is presented, demonstrating the differences in placement error prediction between using a static or a dynamic charging model. We find that substantial improvements can be achieved using the dynamic charging model. Productive implementation of this functionality is the natural next step.
机译:图案布局精度的提高对于解决掩模制造中即将出现的挑战至关重要。放置误差是由多种效应驱动的,其中电子介导的抗蚀剂表面充电是主要的误差源。因此,对该系统效果进行建模可以在印版处理之前确定放置误差。这为有效的充电补偿打开了大门。在本文中,我们研究了在全尺寸掩膜生产布局的情况下两个不同的充电补偿模型的模拟收益。使用无需充电效应校正即可获得的实际放置结果来评估潜在的图形放置改善。提出了两个模型的深度比较,展示了使用静态或动态充电模型之间的放置误差预测差异。我们发现使用动态收费模型可以实现实质性的改进。下一步自然要高效地实现此功能。

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