A cool packaging technology for power conversion application

摘要

Power management relieves critical bottlenecks in saving electrical energy and efficient switching devices are particularly required for synchronous power conversion module. To optimize both switching and thermal efficiencies for convertor configuration it relies on the advanced package technology. An analysis has been undertaken in this work to identify the challenge on power electronic packages to ensure the system efficiencies continue to increase. This paper presents an innovative three-dimension (3D) packaging technology - CoolPAK, which enables high voltage, high frequency and high reliable voltage switching with reduced power loss in thermal dissipation.