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Temperature and hump effect impact on output voltage spread of low power bandgap designed in the sub-threshold area

机译:温度和驼峰效应对亚阈值区域内设计的低功率带隙输出电压分布的影响

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Analog circuit designs are often biased to work in sub-threshold mode for low power constraints and for better gate-source voltage matching performances. Depending on process, hump effect may change MOS characteristics for negative Bulk-Source Voltage (VBS) and have a slight impact for VBS=0V. Actually, even without body effect, hump mainly degrades MOS matching performances in the sub-threshold area with significant temperature dependence. Thus, in order to accurately simulate bandgap performances, modeling of hump effect has to be considered.
机译:模拟电路设计通常偏置以在低功率约束的子阈值模式下工作,并且用于更好的栅极源电压匹配性能。根据过程,驼峰效应可能会改变负散源电压的MOS特性(V BS ),对V BS = 0V产生轻微影响。实际上,即使没有身体效应,驼峰也主要在具有显着温度依赖性的子阈值区域中降低MOS匹配性能。因此,为了准确地模拟带隙性能,必须考虑驼峰效应的建模。

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