首页> 外文会议>2011 IEEE International Solid-State Circuits Conference Digest of Technical Papers >A 300mm wafer-size CMOS image sensor with in-pixel voltage-gain amplifier and column-level differential readout circuitry
【24h】

A 300mm wafer-size CMOS image sensor with in-pixel voltage-gain amplifier and column-level differential readout circuitry

机译:具有像素内电压增益放大器和列级差分读出电路的300mm晶圆尺寸CMOS图像传感器

获取原文

摘要

Large-format image sensors provide us with a new form of vision in several areas such as astronomy and industry. The sensors commonly comprise thin-film transistors (TFTs) and photodiodes (PDs) on amorphous silicon. The capabilities of the amorphous silicon sensors, however, are insufficient due to the low carrier mobility of the TFTs. Recently several large-format CCDs [1] and CMOS image sensors [2,3] have been developed on crystal silicon wafers for faster readout speed, reduced image lag, high sensitivity and reduced noise.
机译:大幅面图像传感器在天文学和工业等多个领域为我们提供了一种新的视觉形式。传感器通常包括非晶硅上的薄膜晶体管(TFT)和光电二极管(PD)。然而,由于TFT的低载流子迁移率,非晶硅传感器的能力不足。最近,已经在晶体硅晶片上开发了几种大型CCD [1]和CMOS图像传感器[2,3],以提高读取速度,减少图像滞后,提高灵敏度和降低噪声。

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号