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NP-completeness result for positive line-by-fill SADP process

机译:正面逐行填充SADP过程的NP完整性结果

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Double patterning (DP) is a necessity for at and below 32nm half pitch production. The two top contending DP technologies are litho-etch-litho-etch (LELE) and self-aligned double patterning (SADP). While both LELE and SADP are actively researched and optimized on the process side [1] [2] [3] [4], CAD support for them has been very different.When cut candidates can be explicitly specified, the problem of LELE mask assignment transforms into the familiar 2-colorability problem and benefits from the extensive research ranging from what originally was conducted for alt-PSM lithography [5], to more recently proposed new techniques for LELE [6], and proof of the inherent computational limitation imposed by hierarchy [7].CAD support for SADP, on the other hand, is almost non-existent. Such lack of CAD support for SADP is not coincidental. For a layout, LELE solutions tend to look similar while SADP solutions can be vastly different in style. Due to the flexibility offered by trim mask, SADP inherently has a much larger solution space than LELE.In this paper, we take the first step in investigating the CAD implications of the positive line-by-fill SADP process by proving that the problem of SADP manufacturability is NP-complete.
机译:双重图案化(DP)是必需品,低于32nm的半间距生产。两个顶级竞争DP技术是Litho-etth-litho-蚀刻(leele)和自对准双图案化(SADP)。虽然LELE和SADP都积极研究和优化在过程侧[1] [2] [3] [3] [4],对它们的CAD支持非常不同。 当切割候选人可以明确指定时,LELE掩模分配问题转变为熟悉的2可色性问题,并从最初为ALT-PSM光刻进行的广泛研究中的优势来自最初的研究[5],以最近提出的新技术LELE [6],以及层次结构施加的固有计算限制的证明[7]。 另一方面,对SADP的CAD支持几乎是不存在的。这种对SADP的CAD支持不一致。对于布局,LELE解决方案往往类似,而SADP解决方案的风格差异很大。由于修剪面具提供的灵活性,SADP固有地具有比LELE更大的解决方案。 在本文中,我们通过证明SADP可制造性问题是NP-Complete的问题,参加第一次调查积极填写SADP过程的CAD影响。

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