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A 20ps resolution wave union FPGA TDC with on-chip real time correction

机译:具有片内实时校正功能的20ps分辨率波联合FPGA TDC

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Benefit from wave union, the bins (especially the ultra-wide bins) are sub-divided by each other, making FPGA TDC achieve a resolution beyond its cell delay. At such high level resolution, delay chain becomes very sensitive to the environment disturbance, including power supply voltage, temperature and current surge. On chip calibration needs lots of events and hence cannot follow fast delay changes of the chain. On-chip real time correction method proposed in this article gives one correcting parameter for each sample, making the FPGA TDC stronger when exposed to fast disturbance. A fast encoding logic is also implemented in our design and the dead time can be reduced to 1 clock cycle in the best case. Test results show a typical RMS of 20ps and the max RMS is below 30ps.
机译:得益于波并集,可将仓位(尤其是超宽仓位)彼此细分,从而使FPGA TDC达到超出其单元延迟的分辨率。在如此高的分辨率下,延迟链对环境干扰非常敏感,包括电源电压,温度和电流浪涌。片上校准需要大量事件,因此无法跟随链的快速延迟变化。本文提出的片上实时校正方法为每个样本提供了一个校正参数,从而使FPGA TDC在受到快速干扰时更坚固。在我们的设计中还实现了快速编码逻辑,在最佳情况下,空载时间可以减少到1个时钟周期。测试结果显示典型RMS为20ps,最大RMS低于30ps。

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