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Nucleation of c-axis Screw Dislocations at Substrate Surface Damage During 4H-Silicon Carbide Homo-Epitaxy

机译:4H-碳化硅同质外延过程中衬底表面损伤时c轴螺丝位错的成核

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Observations of dislocation nucleation occurring at substrate surface scratches during 4H-SiC CVD homoepitaxial growth are reported. Sub-surface residual damage associated with the scratches is observed to act as nucleation sites for basal plane dislocations (BPDs), threading edge dislocations (TEDs) and threading screw dislocations (TSDs) in the epilayer. TEDs and BPDs replicate from the surface intersections of basal plane dislocation half-loops injected into the substrate surface. A model for the nucleation mechanism of TSDs, which nucleate in opposite sign pairs, is presented which involves overgrowth of surface indentations associated with the scratch during step flow growth. Atomic steps which approach these local surface indentations can collapse creating pairs of opposite sign screw dislocations which have Burgers vector magnitude equal to the magnitude of the step disregistry created during the collapse.
机译:报道了在4H-SiC CVD同性恋生长期间在底物表面划痕发生的脱位成核的观察。观察到与划痕相关的亚表面残余损伤,以充当基底平面脱位(BPD),穿线边缘位错(TEDS)和螺纹螺纹螺纹脱位(TSDS)中的核切割位点。 TED和BPDS从注入基板表面的基本平面位错半环的表面交叉点复制。提出了一种关于TSD的成核机理的模型,其在相对的征兆对中核心,其涉及与在步长流动生长期间与划痕相关的表面凹口过度。接近这些局部表面凹口的原子步骤可以折叠产生相对的符号螺杆位错,该对螺杆位错的成对具有等于在崩溃期间产生的步骤互动的大小。

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