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Formation and Influence of the Built-In Surface Potentials on the Transversal Electronic Transport and the VAC of Silicon MIS Structures

机译:横向电子传输的内置表面电位的形成和影响及硅MIS结构的VAC

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The regularities of the modification of the current-voltage characteristics of MIS structures due to the formation of built-in surface potentials are investigated. Surface potentials are formed when an atomically clean surface of silicon crystals is obtained using microwave plasma microprocessing. Microwave plasma microprocessing was carried out in various chemically active gas media. The interpretation of the effect of surface potentials on transversal electron transport and the steepness of the current-voltage characteristics of silicon MIS devices has been experimentally established and proposed.
机译:研究了由于形成内置表面电位而导致MIS结构的电流 - 电压特性的规律。当使用微波等离子体微处理获得硅晶体的原子清洁表面时,形成表面电位。微波等离子体微处理在各种化学活性气体介质中进行。实验和提出了对横向电子传输对横向电子传输对横向电子传输的影响的解释,并提出了硅MIM器件的电流 - 电压特性。

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