Low-cost signature test of RF blocks based on envelope response analysis

摘要

This paper presents a novel and low-cost methodology that can be used for testing RF blocks embedded in complex SoCs. It is based on the detection and analysis of the two-tone response envelope of the device under test (DUT). The response envelope is processed to obtain a simple digital signature sensitive to key specifications of the DUT. The analytical basis of the proposed methodology is demonstrated, and a proposal for its implementation as a built-in test core is discussed. Finally, practical simulation examples show the feasibility of the approach.