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Application-specific 3D Network-on-Chip design using simulated allocation

机译:使用模拟分配的专用3D片上网络设计

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Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-on-Chip (NoC) architecture design in Systems-on-Chip (SoCs). In this paper, we consider the application-specific NoC architecture design problem in a 3D environment. We present an efficient floorplan-aware 3D NoC synthesis algorithm, based on simulated allocation, a stochastic method for traffic flow routing, and accurate power and delay models for NoC components. We demonstrate that this method finds greatly improved topologies for various design objectives such as NoC power (average savings of 34%), network latency (average reduction of 35%) and chip temperature (average reduction of 20%).
机译:三维(3D)硅集成技术为片上系统(SoC)中的片上网络(NoC)架构设计提供了新的机会。在本文中,我们考虑了3D环境中特定于应用程序的NoC架构设计问题。我们基于模拟分配,交通流路由的随机方法以及NoC组件的准确功率和延迟模型,提出了一种有效的可感知平面图的3D NoC合成算法。我们证明,该方法为各种设计目标找到了大大改善的拓扑,例如NoC功耗(平均节省34%),网络延迟(平均减少35%)和芯片温度(平均减少20%)。

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