首页> 外文会议>2010 International Conference on Mechanic Automation and Control Engineering >Mold-Flow analysis in injection molding process of fan back cover
【24h】

Mold-Flow analysis in injection molding process of fan back cover

机译:风扇后盖注塑成型过程中的模流分析

获取原文

摘要

With MoldFlow, the injection molding process of the fan back cover is simulated. The cover's structure is analyzed and its 3-D model is girded and improved. The filling process is studied with the gate's different forms and locations from the weld line, cavitation and so on, and the gate design is optimized. The warpage deformation and volume shrinkage in different processing parameters are analyzed, and thus the process parameters are optimized.
机译:使用MoldFlow,可以模拟风扇后盖的注塑过程。分析了封皮的结构,并对其3-D模型进行了束缚和改进。通过对浇口的不同形式和位置(从熔接线,气蚀等方面)进行研究,以优化浇口的设计。分析了不同工艺参数下的翘曲变形和体积收缩,从而优化了工艺参数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号