Micromachining of Thin Glass Plates with a Femtosecond Laser

摘要

We present a novel method for cutting thin borosilicate glass slides, as well as other results pertaining to laser welding related to an existing technique. Based on the concept of stealth dicing for semiconductor wafers, we have demonstrated that by giving our samples an initial stress and by creating optically induced defects inside the glass, it is possible to efficiently cut a thin glass substrate. The edges are sharp along the whole length of the cut and exempt from debris deposition and deformations. We have also perfected a femtosecond laser welding technique to join borosilicate glass samples with very distinct welded regions.