We consider different sources of potential systematic errors in the thermal interface resistance measurements. Sub-continuum heat conduction and spatial non-equilibrium between electrons and phonons in a metal may lead to overestimation of the thermal interface resistance. The use of an erroneous substrate thermal conductivity can also cause significant systematic errors in steady- and quasi-steady state measurements of the thermal interface resistance. Our results highlight an urgent need for new systematic experimental studies to confirm the magnitude of intrinsic thermal interface resistance.
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