The signal channels that link high speed processors to memory and various other peripherals, are limited by the inherent characteristics of the printed circuit board. These are what ultimately connect information to the outside world. One limiting factor is the effect of non-uniformity of the glass fiber distribution in the printed circuit substrate material, also known as fiber weave effect (FWE). FWE introduces signal skew and timing errors which place an upper limit on bit rate and trace length.Using unique fabrication techniques and a proprietary low dielectric constant glass composition, a revolutionary glass fabric is presented that is essentially free of fiber weave effect while demonstrating inherently improved resistance to conductive anodic filament (CAF) formation. Improved laminate performance is demonstrated with finite element modeling and HyperLynx simulations, and corroborated with dielectric property measurements on prototype substrates.A printed circuit board using this material demonstrates superior signal integrity performance over the traditional glass-based solution. By uniformly distributing glass fibers the maximum surface area becomes available to bond with the resin, which is enhanced by direct application of a finish to provide a high quality interface between glass and resin. Two high profile performance issues, fiber weave effect and CAF, are addressed by a unique laminate reinforcement.
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